Optimized for industrial manufacturing, the MLA 300 Maskless Aligner features distinct benefits for the wafer-level technology: The flexibility of maskless lithography allows rapid design customizations, and even unique designs on each substrate. This is of particular use for chip packaging where mounted die shift and each panel is unique. Meeting these demands, the MLA 300 can be seamlessly integrated into wafer-level packaging production lines, fully automating wafer production with a resolution down to 2 µm lines and spaces.