FSS 310: Ultra-fast ROI inspection Ultra-precise measuring systems are normally very slow and extremely expensive. Not anymore. The FSS 310 has a flexible, fast-moving measurement point within the field of view, enabling ROI inspections in ultra-short cycle times – without compromising accuracy: •High-speed ROI inspection: With a huge scan area of 310 mm, the FSS 310 can check a 12-inch wafer for TTV, bow, warp and voids in standards applications in less than 10 seconds. •Impressive throughout: Over 300 wafers an hour, including handling time.