Bozhi Gold Diamond's TFC ceramic carrier boards, with accurate film thickness and high graphic precision, are mainly used in optical communication optical chips, image sensor chips and other fields with low current and high requirements for device precision, and the substrate material is mainly aluminum nitride. Our company has three magnetron sputtering continuous plating equipment, which is designed and customized by our company, and has reached the highest level in the industry in terms of film layer bonding, film thickness uniformity and batch consistency.